When it comes to semiconductor fabrication, time may be money, but yield trumps all. So critical requirement for process steps must obviously clock with economically-viable throughputs, testing is every bit as important.

With critical dimensions currently in the tens of nanometers across wafers as large as 450 mm, the ability to effectively and repeatably position wafers, optics and measurement equipment is crucial to capturing accurate data. That makes motion control an essential supporting technology for the semiconductor industry.

This XY Stage Assembly using the latest Linear Motor Technology provides the requirement needed for fast and accurate position movement for Prober Wafer Testing.

• Use to load and unload ceramic substrate to Laser Position
• The resistor is measured by probing
• Laser energy is used to remove material to change the resistance
• This high speed indexing with fast settling time enable improvement in machine through-put time

• Assembly machine used for Pick & Place between loading and unloading
• Fast speed
• High accuracy
• Repeatability of motion
• Best fit for high volume manufacturing
• Less maintenance
• Less process error
• Easy to install
• Rigid Design

• Used for laser marking applications
• Uses PBA systems DX ironless linear motor for high speed and high precision motor with low velocity ripple
• DX linear motor's high speed allows processing efficiency
• Smooth motion allows smooth and accurate line engraving

A large scale X-Y stage that is able to move at 0.5mm step pulse

• Uses voice coil actuator (RVCA)
• Improved design with low moving mass
• Fast response
• Excellent reliability
• Ideal for high speed pick & place applications